FEATURE

STANDARD

ADVANCED

R & D

LINE WIDTH

.005"

.004"

.003"

CONDUCTOR SPACING

.005"

.004"

.003"

LAYER TO LAYER

.007"

.005"

.004"

PCB THICKNESS

+/- 7%

+/- 6%

+/- 5%

PROFILE DIMENSIONS

+/- .005%

+/- .004%

+/- .003%

FEATURE

STANDARD

ADVANCED

R & D

DRILLED HOLE MINIMUM

.015"

.012"

.010"

PLATED HOLE MINIMUM

.012"

.010"

.008"

ASPECT RATIO

8:1

8:1

8:1

PLATED HOLE TOLERANCE

+/- .003"

+/- .002"

+/- .002"

INNER LAYER PAD MINIMUM

.028"

.024"

.024"

PLANE CLEARANCE PADS

.030"

.028"

>.028"

OUTER LAYER PAD MINIMUM

.028"

.024"

.024"

FEATURE

STANDARD

ADVANCED

R & D

SMT PAD SPACING

.005"

.004"

>.004"

LINE TO SMT PAD SPACE

.004"

.004"

.004"

MINIMUM PAD CLEARANCE

.002"

.002"

.002"

FEATURE

STANDARD

ADVANCED

R & D

MINIMUM COMMERCIAL

.005"

.002"

.002"

EQUIPMENT LIMITATIONS

COMMUNICATION FORMATS

MAX PANEL SIZE

18" X 24"

DRILL FILES

EXCELLON V. OR V.2

MAX BOARD SIZE

16" X 22"

ARTWORK FILES

GBR (274 OR 274X), DXF, OR EAGLE

MAX BOARD THICKNESS

.250"

EMAIL

PCWI@PACBELL.NET

MIN CORE THICKNESS

.002"

MAX COPPER WEIGHT

INTERNAL 3oz. EXTERNAL 10oz

MIN COPPER WEIGHT

INTERNAL 0.5oz EXTERNAL 0.5oz

MATERIALS

SOLDERMASK

SURFACE FINISHES

FR-4 Tetrafunctional (140°C Tg)

LPI ENTHONE DSR3241 (Standard)

Hot Air Leveling

FR-5 Multifunctional  (150°C Tg)

LPI TAIYO PSR4000

Organic Coatings (OSP)

Getek (175°C - 185°C Tg)

LPI ELECTRA EMP110

Immersion Gold

CEM1, CEM3

DEXTER HYSON SR1020

Immersion Tim

Polyimide

INTERNAL 0.5oz EXTERNAL 0.5oz

All Gold

Cynete Ester

Selective Gold

Flex

Immersion Silver

UNDERWRIGHTERS LABS

FILE #e97589

ISO 9001-2000

011930 (QMI)