Capabilities

Capability matrix

Working limits for standard production. Beyond-matrix requirements are reviewed by engineering — ask, we quote edge cases every week.

Board construction

AttributeStandardAdvancedR & D
Max layers2434
Board thickness (min–max)0.012"–0.125"0.008"–0.250"0.006"–0.250"
Line / space0.005"0.004"0.003"
Drilled hole min.0.010"0.008"0.006"
Plated hole min.0.012"0.010"0.008"
Aspect ratio8:18:18:1

Materials

Rigid laminates

Standard and high-Tg FR-4, halogen-free options, high-speed low-Dk laminates.

FR-4 · HIGH-TG · LOW-DK

Flex materials

Adhesive and adhesiveless polyimide, coverlay, and stiffener options (PI, FR-4, stainless).

POLYIMIDE · COVERLAY

RF / high-frequency

PTFE and ceramic-filled laminates for RF and microwave builds, hybrid stackups supported.

ROGERS-CLASS · HYBRID

Copper, pads & tolerances

AttributeStandardAdvancedR & D
Copper foil (min/max, oz)0.5 / 1.00.5 / 8.010.0
Max copper weightInternal 3.0 ozExternal 10 oz
Pad size internal (dia over drill)0.014"0.008"0.008"
Pad size external (dia over drill)0.012"0.008"0.008"
Plated hole tolerance±0.003"±0.002"±0.002"
Hole-to-image tolerance±0.006"±0.004"±0.004"
Hole size tol. (plated / unplated)±0.003" / ±0.002"

Flex materials ranked for reliability (best → riskiest): AP adhesiveless → LF kapton acrylic → FR fire-retardant → FR4 rigid. Rigid-flex bend design (hole keep-outs, tear stops, bend radii) is reviewed with our engineering team on every quote.

Finishes & test

Surface finishes

ENIG, immersion silver, immersion tin, HASL and lead-free HASL, OSP, and hard/soft gold for edge connectors.

ENIG · IMM AG/SN · LF-HASL · OSP · AU

Inspection & electrical test

100% netlist electrical test, AOI on inner layers, first-article inspection, and IPC-A-600 Class 2 or Class 3 acceptance per your spec.

100% E-TEST · AOI · FAI · IPC CLASS 2/3

Don't see your requirement? Send the package — engineering reviews every quote.