| Technology: | Flex, Rigid-Flex and Printed Circuit Board |
| Quick Turnaround: | FLEX 2 - 3 Business Days (Standard Complexity) Rigid Flex 3 - 5 Business Days (Standard Complexity) Printed Circuit Board 3 - 5 Business Days (Standard Complexity) |
| Layer | I - 34 |
| Via Interconnect | Blind and Buried Via |
| Finishes: | SMOBC, HASL LEADFREE, Hard, Soft, Immersion Gold, Silver Immersion, Palladium, and OSP |
| SMT: | 8 Mil Pitch |
| Material Rigid: | GF FR 4, GI Polyimide, Getek, and Rogers |
| Material Flex: | Dupont, Pyralux, Roger FR |
| Etchback: | Plasma |
| Impedence: | +/- 5% and 10% |
| Solder Mask: | Liquid Photo Imageable |
| Inspection: | Automatic Optical Inspection |
| Electrical Test: | Flying Probe, Top & Bottom Fixtures, Net List |
| Fabrication: | V-Score, Mil-down, Counter sink and bore, Edge-bevel gold connectors. |
| Panel Size: | 18 x 24, 12 x 18 |
| Max. Board Size: | 16 x 22 |
| Design and Layout: | Please provide us your Schematic Diagram, Bill of Material Fabrication notes. |
| Component Assembly: | Please provide us your Gerber Data, Bill of Materials, and Assembly Notes. |
